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In high-end industries such as semiconductor manufacturing, biomedicine, and precision electronics, cleanroom environmental stability directly determines product yield, process consistency, and research reliability.

To meet increasingly stringent control requirements, the MAU + FFU + DCC (Make-Up Air Unit + Fan Filter Unit + Dry Coil Unit) architecture has become the mainstream solution for modern cleanrooms. Through layered air treatment and intelligent coordination, this system achieves precise control of temperature, humidity, cleanliness, and pressure, while significantly improving energy efficiency and operational flexibility.This article systematically explains the key control technologies behind the MAU + FFU + DCC system and illustrates how multi-dimensional coordination creates a stable, high-performance cleanroom environment.

The MAU + FFU + DCC system adopts a hierarchical air treatment strategy, where each subsystem performs a dedicated function:

• Primary temperature and humidity regulation
• G4 + F8 multi-stage filtration
• Stable supply of conditioned outdoor air

• HEPA or ULPA filtration
• Unidirectional airflow delivery
• Supports ISO Class 5 to ISO Class 1 environments

• Local temperature trimming
• Rapid compensation for equipment heat loads
• Ensures uniform room temperature distribution

Together, this “Preprocessing → Purification → Fine Control" architecture provides greater precision, flexibility, and energy efficiency than traditional centralized HVAC systems.

Temperature fluctuation is a critical risk in precision manufacturing. In semiconductor lithography, for example, a deviation of just 0.1°C can affect pattern alignment.

The MAU + FFU + DCC system achieves multi-level temperature control:

MAU – Primary Regulation

• Adaptive PID control of heating and cooling coils
• Fresh air temperature stability within ±0.5°C
• Dynamic response to load changes

FFU – Airflow Optimization

• Uniform matrix layout
• Typical face velocity: 0.3–0.5 m/s
• Reduces thermal stratification and local hotspots

DCC – Real-Time Heat Compensation

• Targets heat from lithography tools, bioreactors, etching equipment
• Adjusts chilled water flow instantly
• Maintains room temperature uniformity within ±0.2°C

Case Reference
A 12-inch semiconductor fab achieved ±0.1°C room stability after implementing coordinated MAU–DCC control, improving lithography yield by approximately 3%.

Humidity directly affects electrostatic discharge, corrosion, microbial growth, and process stability.

MAU – Main Humidity Adjustment

• Steam or electrode humidifiers
• Condensation or rotary dehumidification
• Control accuracy up to ±2% RH

Example: Freeze-drying workshops typically require 30–40% RH to prevent moisture absorption.

FFU – Uniform Distribution

• Eliminates stagnant zones and dead corners
• Prevents local high-humidity accumulation

MAU + DCC Coordination

• MAU controls absolute humidity
• DCC adjusts coil temperature
• Coil surface temperature maintained 1–2°C above dew point to avoid condensation

Cleanliness remains the core performance indicator of any cleanroom.

MAU Pre-Filtration

• G4 primary filter
• F8 medium-efficiency filter
• Removes large particles and protects FFU lifespan

FFU Terminal Filtration

• HEPA: ≥99.97% @ 0.3 μm
• ULPA: ≥99.999% @ 0.12 μm
• Supports ISO Class 5 and higher

Airflow Organization

• Vertical unidirectional flow
• FFU coverage: 60–100%
• Creates a stable piston effect, pushing contaminants toward return air grilles

Performance Reference
At 0.45 m/s airflow velocity, particle concentration ≥0.5 μm can be reduced to
<35 particles/ft³ (ISO Class 5).

Positive pressure ensures clean areas remain protected from external contamination.

Fresh Air Volume Control (MAU)

• Differential pressure sensors monitor room pressure
• Typical pressure difference: 10–30 Pa

Hierarchical Zoning

• Between ISO Class 5 and ISO Class 7 areas
• Pressure gradient: 5–10 Pa

Emergency Protection

• Automatic alarms triggered by pressure drop
• Backup fans activate immediately
• Prevents contamination during abnormal conditions

Modern MAU + FFU + DCC systems integrate intelligent automation for precision and efficiency.

• Real-time monitoring of 30+ parameters
• Trend analysis and historical data storage
• Centralized system visualization

When a high-load tool starts operation, the system automatically:

• Increases cooling coil capacity
• Boosts DCC output
• Restores environmental stability within 10 seconds

Continuous monitoring of:

• FFU motor current
• Filter pressure drop
• DCC coil performance

Enables early detection of:

• Motor aging
• Filter clogging
• Abnormal airflow resistance

AI-driven optimization regulates:

• FFU operating quantity
• Fresh air ratio
• Temperature and humidity load matching

Resulting in 20–30% energy savings, especially in large semiconductor fabs.

• MAU: inverter testing, filter resistance, T/H response
• FFU: airflow uniformity (±10%), HEPA leak test, noise ≤65 dB
• DCC: water flow accuracy (±5%), heat exchange verification

• Simulated extreme conditions
• High-precision particle counters (0.1 μm)
• 50+ monitoring points with 10-second logging

• Variable FFU control during partial load operation
• Typical filter replacement cycles:
  • Primary: 1–3 months
  • Medium: 6–12 months
  • HEPA: 2–3 years

The MAU + FFU + DCC cleanroom system represents a transition from basic compliance to intelligent, lean environmental control.

Through coordinated management of temperature, humidity, cleanliness, and pressure—supported by advanced automation and predictive analytics—this architecture delivers the stability and precision required for semiconductor manufacturing, biotechnology, and other high-end applications.

As a professional cleanroom engineering solution provider, we offer:

• System design
• Equipment selection
• Intelligent control integration
• Commissioning and optimization
• Full lifecycle support

If you are planning or upgrading a high-precision cleanroom, our engineering team is ready to help you achieve world-class environmental control performance.